The following publications are possibly variants of this publication:
- Thermal-driven analog placement considering device matchingPo-Hung Lin, Hongbo Zhang, Martin D. F. Wong, Yao-Wen Chang. dac 2009: 593-598 [doi]
- Thermal-Driven Analog Placement Considering Device MatchingPo-Hung Lin, Hongbo Zhang, Martin D. F. Wong, Yao-Wen Chang. tcad, 30(3):325-336, 2011. [doi]
- Performance-driven analog placement considering boundary constraintCheng-Wu Lin, Jai-Ming Lin, Chun-Po Huang, Soon-Jyh Chang. dac 2010: 292-297 [doi]
- Recent Research and Emerging Challenges in Physical Design for Manufacturability/ReliabilityChung-Wei Lin, Ming-Chao Tsai, Kuang-Yao Lee, Tai-Chen Chen, Ting-Chi Wang, Yao-Wen Chang. aspdac 2007: 238-243 [doi]