A layout dependent full-chip copper electroplating topography model - researchr publication authors

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Jianfeng Luo, Qing Su, Charles Chiang, Jamil Kawa. A layout dependent full-chip copper electroplating topography model. In 2005 International Conference on Computer-Aided Design (ICCAD 05), November 6-10, 2005, San Jose, CA, USA. pages 133-140, IEEE Computer Society, 2005.

This author has not been identified. Look up 'Jianfeng Luo' in GoogleThis author has not been identified. Look up 'Qing Su' in GoogleThis author has not been identified. Look up 'Charles Chiang' in GoogleThis author has not been identified. Look up 'Jamil Kawa' in Google

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