Jianfeng Luo, Qing Su, Charles Chiang, Jamil Kawa. A layout dependent full-chip copper electroplating topography model. In 2005 International Conference on Computer-Aided Design (ICCAD 05), November 6-10, 2005, San Jose, CA, USA. pages 133-140, IEEE Computer Society, 2005.
@inproceedings{LuoSCK05,
title = {A layout dependent full-chip copper electroplating topography model},
author = {Jianfeng Luo and Qing Su and Charles Chiang and Jamil Kawa},
year = {2005},
tags = {layout},
researchr = {https://researchr.org/publication/LuoSCK05},
cites = {0},
citedby = {0},
pages = {133-140},
booktitle = {2005 International Conference on Computer-Aided Design (ICCAD 05), November 6-10, 2005, San Jose, CA, USA},
publisher = {IEEE Computer Society},
isbn = {0-7803-9254-X},
}