Simulation and experimental characterization of reservoir and via layout effects on electromigration lifetime

H. V. Nguyen, Cora Salm, R. Wenzel, A. J. Mouthaan, Fred G. Kuper. Simulation and experimental characterization of reservoir and via layout effects on electromigration lifetime. Microelectronics Reliability, 42(9-11):1421-1425, 2002. [doi]

Abstract

Abstract is missing.