Herman Oprins, A. Srinivasan, Miroslav Cupák, V. Cherman, C. Torregiani, Michele Stucchi, Geert Van der Plas, Paul Marchal, Bart Vandevelde, E. Cheng. Fine grain thermal modeling and experimental validation of 3D-ICs. Microelectronics Journal, 42(4):572-578, 2011. [doi]
@article{OprinsSCCTSPMVC11,
title = {Fine grain thermal modeling and experimental validation of 3D-ICs},
author = {Herman Oprins and A. Srinivasan and Miroslav Cupák and V. Cherman and C. Torregiani and Michele Stucchi and Geert Van der Plas and Paul Marchal and Bart Vandevelde and E. Cheng},
year = {2011},
doi = {10.1016/j.mejo.2010.08.006},
url = {http://dx.doi.org/10.1016/j.mejo.2010.08.006},
tags = {modeling, C++},
researchr = {https://researchr.org/publication/OprinsSCCTSPMVC11},
cites = {0},
citedby = {0},
journal = {Microelectronics Journal},
volume = {42},
number = {4},
pages = {572-578},
}