The following publications are possibly variants of this publication:
- Fine grain thermal modeling and experimental validation of 3D-ICsOprins, H., Adi Srinivasan, Cupak, M., Cherman, V., Torregiani, C., Stucchi, M., {Van der Plas}, G., Marchal, P., Vandevelde, B., Cheng, E.. mj, 42(4):572-578, April 2011. [doi]
- Experimental characterization and model validation of thermal hot spots in 3D stacked ICsOprins, H., Cherman, V., Adi Srinivasan, Cupak, M., {Van der Plas}, G., Marchal, P., Vandevelde, B., Cheng, E.. Thermal Investigations of ICs and Systems (THERMINIC), 2010 16th International Workshop on, :1-5, 2010.
- Fine grain thermal modeling of 3D stacked structuresOprins, H., Cupak, M., {Van der Plas}, G., Marchal, P., Vandevelde, B., Adi Srinivasan, Cheng, E.. Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on, :45-49, 2009.