Fine grain thermal modeling and experimental validation of 3D-ICs - researchr publication authors

researchr

You are not signed in
Sign in
Sign up

Herman Oprins, A. Srinivasan, Miroslav Cupák, V. Cherman, C. Torregiani, Michele Stucchi, Geert Van der Plas, Paul Marchal, Bart Vandevelde, E. Cheng. Fine grain thermal modeling and experimental validation of 3D-ICs. Microelectronics Journal, 42(4):572-578, 2011. [doi]

This author has not been identified. Look up 'Herman Oprins' in GoogleThis author has not been identified. It may be one of the following persons:

Adi Srinivasan

Look up 'A. Srinivasan' in GoogleThis author has not been identified. Look up 'Miroslav Cupák' in GoogleThis author has not been identified. Look up 'V. Cherman' in GoogleThis author has not been identified. Look up 'C. Torregiani' in GoogleThis author has not been identified. Look up 'Michele Stucchi' in GoogleThis author has not been identified. Look up 'Geert Van der Plas' in GoogleThis author has not been identified. Look up 'Paul Marchal' in GoogleThis author has not been identified. Look up 'Bart Vandevelde' in GoogleThis author has not been identified. Look up 'E. Cheng' in Google

runs on WebDSL