Herman Oprins, A. Srinivasan, Miroslav Cupák, V. Cherman, C. Torregiani, Michele Stucchi, Geert Van der Plas, Paul Marchal, Bart Vandevelde, E. Cheng. Fine grain thermal modeling and experimental validation of 3D-ICs. Microelectronics Journal, 42(4):572-578, 2011. [doi]
Abstract is missing.