Impact of mid-bond testing in 3D stacked ICs - researchr publication authors

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Mottaqiallah Taouil, Said Hamdioui, Erik Jan Marinissen, Sudipta Bhawmik. Impact of mid-bond testing in 3D stacked ICs. In 2013 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems, DFT 2013, New York City, NY, USA, October 2-4, 2013. pages 178-183, IEEE, 2013. [doi]

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