Mottaqiallah Taouil, Said Hamdioui, Erik Jan Marinissen, Sudipta Bhawmik. Impact of mid-bond testing in 3D stacked ICs. In 2013 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems, DFT 2013, New York City, NY, USA, October 2-4, 2013. pages 178-183, IEEE, 2013. [doi]
@inproceedings{TaouilHMB13,
title = {Impact of mid-bond testing in 3D stacked ICs},
author = {Mottaqiallah Taouil and Said Hamdioui and Erik Jan Marinissen and Sudipta Bhawmik},
year = {2013},
doi = {10.1109/DFT.2013.6653603},
url = {http://dx.doi.org/10.1109/DFT.2013.6653603},
researchr = {https://researchr.org/publication/TaouilHMB13},
cites = {0},
citedby = {0},
pages = {178-183},
booktitle = {2013 IEEE International Symposium on Defect and Fault Tolerance in VLSI and Nanotechnology Systems, DFT 2013, New York City, NY, USA, October 2-4, 2013},
publisher = {IEEE},
}