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Shengcheng Wang, Taeyoung Kim 0001, Zeyu Sun, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori. Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs. IEEE Trans. VLSI Syst., 26(3):531-543, 2018. [doi]