The following publications are possibly variants of this publication:
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- Electromigration-Aware Local-Via Allocation in Power/Ground TSVs of 3-D ICsShengcheng Wang, Mehdi Baradaran Tahoori. tvlsi, 25(10):2881-2892, 2017. [doi]
- Defect Clustering-Aware Spare-TSV Allocation in 3-D ICs for Yield EnhancementShengcheng Wang, Krishnendu Chakrabarty, Mehdi Baradaran Tahoori. tcad, 38(10):1928-1941, 2019. [doi]