Electromigration-Aware Local-Via Allocation in Power/Ground TSVs of 3-D ICs

Shengcheng Wang, Mehdi Baradaran Tahoori. Electromigration-Aware Local-Via Allocation in Power/Ground TSVs of 3-D ICs. IEEE Trans. VLSI Syst., 25(10):2881-2892, 2017. [doi]

Abstract

Abstract is missing.