Electromigration-Aware Local-Via Allocation in Power/Ground TSVs of 3-D ICs

Shengcheng Wang, Mehdi Baradaran Tahoori. Electromigration-Aware Local-Via Allocation in Power/Ground TSVs of 3-D ICs. IEEE Trans. VLSI Syst., 25(10):2881-2892, 2017. [doi]

Authors

Shengcheng Wang

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Mehdi Baradaran Tahoori

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