The following publications are possibly variants of this publication:
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- Thermal-aware TSV repair for electromigration in 3D ICsShengcheng Wang, Mehdi Baradaran Tahoori, Krishnendu Chakrabarty. date 2016: 1291-1296 [doi]
- Decoupling Capacitor Topologies for TSV-Based 3-D ICs With Power GatingHailang Wang, Emre Salman. tvlsi, 23(12):2983-2991, 2015. [doi]