Shengcheng Wang, Mehdi Baradaran Tahoori. Electromigration-Aware Local-Via Allocation in Power/Ground TSVs of 3-D ICs. IEEE Trans. VLSI Syst., 25(10):2881-2892, 2017. [doi]
@article{WangT17-18,
title = {Electromigration-Aware Local-Via Allocation in Power/Ground TSVs of 3-D ICs},
author = {Shengcheng Wang and Mehdi Baradaran Tahoori},
year = {2017},
doi = {10.1109/TVLSI.2017.2716821},
url = {http://doi.ieeecomputersociety.org/10.1109/TVLSI.2017.2716821},
researchr = {https://researchr.org/publication/WangT17-18},
cites = {0},
citedby = {0},
journal = {IEEE Trans. VLSI Syst.},
volume = {25},
number = {10},
pages = {2881-2892},
}