Shengcheng Wang, Taeyoung Kim 0001, Zeyu Sun, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori. Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs. IEEE Trans. VLSI Syst., 26(3):531-543, 2018. [doi]
@article{WangKSTT18,
title = {Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs},
author = {Shengcheng Wang and Taeyoung Kim 0001 and Zeyu Sun and Sheldon X.-D. Tan and Mehdi Baradaran Tahoori},
year = {2018},
doi = {10.1109/TVLSI.2017.2775586},
url = {http://doi.ieeecomputersociety.org/10.1109/TVLSI.2017.2775586},
researchr = {https://researchr.org/publication/WangKSTT18},
cites = {0},
citedby = {0},
journal = {IEEE Trans. VLSI Syst.},
volume = {26},
number = {3},
pages = {531-543},
}