Prebond Testing and Test-Path Design for the Silicon Interposer in 2.5-D ICs

Ran Wang, Zipeng Li, Sukeshwar Kannan, Krishnendu Chakrabarty. Prebond Testing and Test-Path Design for the Silicon Interposer in 2.5-D ICs. IEEE Trans. on CAD of Integrated Circuits and Systems, 36(8):1406-1419, 2017. [doi]

Authors

Ran Wang

This author has not been identified. Look up 'Ran Wang' in Google

Zipeng Li

This author has not been identified. Look up 'Zipeng Li' in Google

Sukeshwar Kannan

This author has not been identified. Look up 'Sukeshwar Kannan' in Google

Krishnendu Chakrabarty

This author has not been identified. Look up 'Krishnendu Chakrabarty' in Google