The following publications are possibly variants of this publication:
- Scan-Based Testing of Post-Bond Silicon Interposer Interconnects in 2.5-D ICsRan Wang, Krishnendu Chakrabarty, Bill Eklow. tcad, 33(9):1410-1423, 2014. [doi]
- Interconnect Testing and Test-Path Scheduling for Interposer-Based 2.5-D ICsRan Wang, Krishnendu Chakrabarty, Sudipta Bhawmik. tcad, 34(1):136-149, 2015. [doi]
- Layout-Aware Optimized Prebond Silicon Interposer Test SynthesisKatherine Shu-Min Li, Sying-Jyan Wang, Ruei-Ting Gu, Bo-Chuan Cheng. dt, 34(6):77-83, 2017. [doi]
- Pre-bond testing of the silicon interposer in 2.5D ICsRan Wang, Zipeng Li, Sukeshwar Kannan, Krishnendu Chakrabarty. date 2016: 978-983 [doi]
- Post-bond Testing of the Silicon Interposer and Micro-bumps in 2.5D ICsRan Wang, Krishnendu Chakrabarty, Bill Eklow. ats 2013: 147-152 [doi]