High-speed and low-power 2.5D I/O circuits for memory-logic-integration by through-silicon interposer

Jiacheng Wang, Shunli Ma, Sai Manoj Pudukotai Dinakarrao, Mingbin Yu, Roshan Weerasekera, Hao Yu. High-speed and low-power 2.5D I/O circuits for memory-logic-integration by through-silicon interposer. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-4, IEEE, 2013. [doi]

Abstract

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