Yi Zhao, S. Saqib Khursheed, Bashir M. Al-Hashimi, Zhiwen Zhao. Co-optimization of fault tolerance, wirelength and temperature mitigation in TSV-based 3D ICs. In 2016 IFIP/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2016, Tallinn, Estonia, September 26-28, 2016. pages 1-6, IEEE, 2016. [doi]
Abstract is missing.