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Cheng Zhuo, Kaviraj Chopra, Dennis Sylvester, David Blaauw. Process Variation and Temperature-Aware Full Chip Oxide Breakdown Reliability Analysis. IEEE Trans. on CAD of Integrated Circuits and Systems, 30(9):1321-1334, 2011. [doi]
Possibly Related PublicationsThe following publications are possibly variants of this publication: A statistical approach for full-chip gate-oxide reliability analysisKaviraj Chopra, Cheng Zhuo, David Blaauw, Dennis Sylvester. iccad 2008: 698-705 [doi] Analysis of System-Level Reliability Factors and Implications on Real-Time Monitoring Methods for Oxide Breakdown Device FailuresEric Karl, Dennis Sylvester, David Blaauw. isqed 2008: 391-395 [doi] Process variation and temperature-aware reliability managementCheng Zhuo, Dennis Sylvester, David Blaauw. date 2010: 580-585 [doi] Post-fabrication measurement-driven oxide breakdown reliability prediction and managementCheng Zhuo, David Blaauw, Dennis Sylvester. iccad 2009: 441-448 [doi]
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