Abstract is missing.
- Maker trends: The path of least resistancePete Dokter. 1-21 [doi]
- The road to 5G: Providing the connectivity fabric for everythingMatt Grob. 1-26 [doi]
- Mars: A 64-core ARMv8 processorCharles Zhang. 1-23 [doi]
- I/O virtualization and system acceleration in POWER8Michael Gschwind. 1-26 [doi]
- Ultra-low power wireless SoCs enabling a batteryless IoTBenton H. Calhoun, David D. Wentzloff. 1-45 [doi]
- Toward accelerating deep learning at scale using specialized hardware in the datacenterKalin Ovtcharov, Olatunji Ruwase, Joo-Young Kim, Jeremy Fowers, Karin Strauss, Eric S. Chung. 1-38 [doi]
- Ultra-low-light CMOS biosensor helps tackle infectious diseasesZhimin Ding. 1-23 [doi]
- Flexible video processing platform for 8K UHD TVSukjin Kim, Young-Hwan Park, Jaehyun Kim, Minsoo Kim, Wonchang Lee, Shihwa Lee. 1 [doi]
- Stratix® 10: 14nm FPGA delivering 1GHzMike Hutton. 1-24 [doi]
- Professional H.265/HEVC encoder LSI toward high-quality 4K/8K broadcast infrastructureHiroe Iwasaki, Takayuki Onishi, Ken Nakamura, Koyo Nitta, Takashi Sano, Yukikuni Nishida, Kazuya Yokohari, Jia Su, Naoki Ono, Ritsu Kusaba, Atsushi Sagata, Mitsuo Ikeda, Atsushi Shimizu. 1-24 [doi]
- Intel® Xeon® Processor D: The First Xeon processor optimized for dense solutionsDheemanth Nagaraj, Chris Gianos. 1-22 [doi]
- Lagopus FPGA - A reprogrammable data plane for high-performance software SDN switchesK. Yamazaki, Y. Nakajima, T. Hatano, A. Miyazaki. 1 [doi]
- UltraScale+ MPSoC and FPGA familiesVamsi Boppana, Sagheer Ahmad, Ilya Ganusov, Vinod Kathail, Vidya Rajagopalan, Ralph Wittig. 1-37 [doi]
- Architecture of the Hexagon™ 680 DSP for mobile imaging and computer visionLucian Codrescu. 1-26 [doi]
- Comparison of Key/Value Store (KVS) in software and programmable hardwareJohn W. Lockwood. 1-8 [doi]
- Implementing software defined radio on the paralellaAndreas Olofsson. 1-32 [doi]
- Current trends for hardware and software developersVrajesh Bhavsar. 1-36 [doi]
- PULP: A parallel ultra low power platform for next generation IoT applicationsDavide Rossi, Francesco Conti 0001, Andrea Marongiu, Antonio Pullini, Igor Loi, Michael Gautschi, Giuseppe Tagliavini, Alessandro Capotondi, Philippe Flatresse, Luca Benini. 1-39 [doi]
- A low-power and real-time augmented reality processor for the next generation smart glassesGyeonghoon Kim, Hoi-Jun Yoo. 1 [doi]
- Under 100-cycle thread migration latency in a single-ISA heterogeneous multi-core processorElliott Forbes, Zhenqian Zhang, Randy Widialaksono, Brandon H. Dwiel, Rangeen Basu Roy Chowdhury, Vinesh Srinivasan, Steve Lipa, Eric Rotenberg, W. Rhett Davis, Paul D. Franzon. 1 [doi]
- MIAOW: An open source GPGPUVinay Gangadhar, Raghuraman Balasubramanian, Mario Drumond, Ziliang Guo, Jai Menon 0003, Cherin Joseph, Robin Prakash, Sharath Prasad, Pradip Vallathol, Karu Sankaralingam. 1-43 [doi]
- LS2085/8A Freescale's new QorlQ Layerscape communications processorZheng John Xu. 1-25 [doi]
- IoT device development challenges and solutionsVenkat Mattela. 1-19 [doi]
- The ARM® Mali-T880 Mobile GPUIan Bratt. 1-27 [doi]
- Kalray MPPA®: Massively parallel processor array: Revisiting DSP acceleration with the Kalray MPPA Manycore processorBenoît Dupont de Dinechin. 1-27 [doi]
- Makers from Hobbyists to professionalsChristopher Nitta. 1-5 [doi]
- Raven: A 28nm RISC-V vector processor with integrated switched-capacitor DC-DC converters and adaptive clockingYunsup Lee, Brian Zimmer, Andrew Waterman, Alberto Puggelli, Jaehwa Kwak, Ruzica Jevtic, Ben Keller, Stevo Bailey, Milovan Blagojevic, Pi-Feng Chiu, Henry Cook, Rimas Avizienis, Brian C. Richards, Elad Alon, Borivoje Nikolic, Krste Asanovic. 1-45 [doi]
- Knights landing (KNL): 2nd Generation Intel® Xeon Phi processorAvinash Sodani. 1-24 [doi]
- Atom™ - x5/x7 Series processor, codenamed Cherry TrailSteven Tu. 1-28 [doi]
- Oracle's Sonoma processor: Advanced low-cost SPARC processor for enterprise workloadsBasant Vinaik, Rahoul Puri. 1-23 [doi]
- A silicon anti-virus engineAdrian Tang, John Demme, Simha Sethumadhavan, Salvatore J. Stolfo. 1 [doi]
- Deep learning & convolutional networksYann LeCun. 1-95 [doi]
- Design of a low power SoC testchip for wearables and IoTsMay Wu, Ravi Iyer, Yatin Hoskote, Steven Zhang, Julio Zamora, German Fabila Garcia, Ilya Klotchkov, Mukesh Bhartiya. 1-27 [doi]
- A scalable heterogeneous multicore architecture for ADAS: Presented at HOT CHIPS: A symposium on high performance chips Flint Center, Cupertino, CAZoran Nikolic, Rama Venkatasubramanian, Jason A. T. Jones, Peter Labaziewicz. 1-32 [doi]
- NMI: A new memory interface to enable innovationDavid Roberts, Amin Farmahini Farahani, Kevin Cheng, Nathan Hu, David Mayhew, Michael Ignatowski. 1 [doi]
- 10G | 5G | 2.5G | 1G | 100M physical layer PHY: HOT CHIPS 2015 conferenceRamin Shirani, Ramin Farjad-Rad. 1-27 [doi]
- Energy efficient graphics and multimedia in 28NM Carrizo APUGuhan Krishnan, Dan Bouvier, Louis Zhang, Praveen Dongara. 1-34 [doi]
- AMD's next generation GPU and high bandwidth memory architecture: FURYJoe Macri. 1-26 [doi]
- Deep learning: Architectures, algorithms, applicationsRoland Memisevic. 1-127 [doi]