J. Wei - researchr alias

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Viewing Publication 1 - 21 from 21

2023

Multi-body 3D-2D registration for robot-assisted joint reduction: preclinical evaluation in the ankle syndesmosisRohan C. Vijayan, K. Venkataraman, J. Wei, Niral Sheth, Babar Shafiq, Jeffrey H. Siewerdsen, Wojciech Zbijewski, Gang Li 0018, Kevin Cleary, Ali Uneri. miigp 2023: [doi]

2022

Coherent pixel selection using a dual-channel 1-D CNN for time series InSAR analysisY. Zhang, J. Wei, M. Duan, Y. Kang, Q. He, H. Wu, Z. Lu. aeog, 112:102927, 2022. [doi]

2020

Comparative Analysis of Gait Speed Estimation Using Wideband and Narrowband Radars, Thermal Camera, and Motion Tracking Suit TechnologiesPlinio Pelegrini Morita, A. S. Rocha, George Shaker, D. Lee, J. Wei, B. Fong, A. Thatte, A. Karimi, L. Xu, A. Ma, A. Wong, Jennifer Boger. jhir, 4(3):215-237, 2020. [doi]

2017

2014

Advances in $\hbox{CO}_{2}$ Observations From AIRS and ACOSJ. Wei, Andrey Savtchenko, B. Vollmer, T. Hearty, A. Albayrak, D. Crisp, Annmarie Eldering. lgrs, 11(5):891-895, 2014. [doi]

2013

GPU-accelerated Monte Carlo simulation of particle coagulation based on the inverse methodJ. Wei, F. E. Kruis. jcphy, 249:67-79, 2013. [doi]

Load balancing of dynamical distribution networks with flow constraints and unknown in/outflowsJ. Wei, A. J. van der Schaft. scl, 62(11):1001-1008, 2013. [doi]

Maximizing the user experience with energy-based fair sharing in battery limited mobile systemsJ. Wei, E. Juarez, Matías J. Garrido, Fernando Pescador. tce, 59(3):690-698, 2013. [doi]

2012

Silicon-Polymer Electro-thermal bimorph actuators with SiC bottom-layer for large out-of-plane motion and improved power efficiencyM. Aarts, J. Wei, P. M. Sarro. nems 2012: 253-256 [doi]

Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancementC. S. Tan, Dau Fatt Lim, Xiao Fang Ang, J. Wei, K. C. Leong. mr, 52(2):321-324, 2012. [doi]

2011

Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolutionH. Xu, C. Liu, V. V. Silberschmidt, Z. Chen, J. Wei, M. Sivakumar. mr, 51(1):113-118, 2011. [doi]

2010

A hybrid Particle Swarm Evolutionary Algorithm for Constrained Multi-Objective OptimizationJ. Wei, Y. Wang, H. Wang. cai, 29(5):701-718, 2010. [doi]

2008

Development of a mobile learning model with usability features for online educationJ. Wei, J. Zhuo, H. Zhang. ijmlo, 2(1):18-35, 2008. [doi]

2007

Single Droplet Pattern in the Cylindrical Phase of Diblock Copolymer MorphologyX. Ren, J. Wei. jns, 17(5):471-503, 2007. [doi]

2004

A new rate-distortion model for video transmission using multiple logarithmic functionsJ. Wei, B. H. Soong, Z. G. Li. spl, 11(8):694-697, 2004. [doi]

2003

Hopf bifurcations of BI-parameter Ordinary Differential SystemsR. Zhang, J. Wei, Q. Huang. IJBC, 13(6):1545-1560, 2003. [doi]

2001

On the Modelling of Document Exchange Processes in E-Commerce ProtocolsX. Wang, S. C. Cheung, J. Wei. apaqs 2001: 387-396 [doi]

2000

Mining Term Association Rules for Automatic Global Query Expansion: Methodology and Preliminary ResultsJ. Wei, Stéphane Bressan, Beng Chin Ooi. wise 2000: 366-373

1990

Entwicklung dreidimensionaler Fusionstechniken für Abstands- und Intensitätsbilder auf der Basis eines doppelt synchronisierten Laser-ScannersJ. Wei, Paul Levi. dagm 1990: 316-323

1967

Numerical Solution of Parabolic Partial Differential Equations With Two-Point Boundary Conditions by Use of the Method of LinesJ. S. Hicks, J. Wei. JACM, 14(3):549-562, 1967. [doi]

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