External Links

    Journal: IEEE Micro

    Volume 45, Issue 3

    4 -- 5Hsien-Hsin S. Lee. Toward Disaggregated and Heterogenous AI Systems
    6 -- 7Rob Aitken, Larry Yang. Special Issue on Hot Chips 2024
    8 -- 14Gerard Williams, Pradeep Kanapathipillai. Qualcomm Oryon CPU in Snapdragon X Elite: Micro-Architecture and Design
    15 -- 21Nadav Bonen, Arik Gihon, Leon Polishuk, Yoni Aizik, Yulia Okunev, Tsvika Kurts, Nithiyanandan Bashyam. Lunar Lake an Intel Mobile Processor: SoC Architecture Overview (2024)
    22 -- 30Tomai Knopp, Jeffrey Chu, Sagheer Ahmad. AMD Versal AI Edge Series Gen 2
    31 -- 40Michael D. Powell, Patrick Fleming, Venkidesh Iyer Krishna, Naveen Lakkakula, Subhiksha Ravisundar, Praveen Mosur, Arijit Biswas, Pradeep Dubey, Kapil Sood, Andrew Cunningham, Smita Kumar. Intel Xeon 6 Product Family
    41 -- 48Alan Smith 0003, Vamsi Krishna Alla. AMD Instinct MI300X: A Generative AI Accelerator and Platform Architecture
    49 -- 57Kaifan Wang, Jian Chen, Yinan Xu 0001, Zihao Yu, Wei He, Dan Tang, Ninghui Sun, Yungang Bao. XiangShan: An Open Source Project for High-Performance RISC-V Processors Meeting Industrial-Grade Standards
    58 -- 65Kalhan Koul, Zhouhua Xie, Maxwell Strange, Sai Gautham Ravipati, Bo-Wun Cheng, Olivia Hsu, Po-Han Chen, Mark Horowitz, Fredrik Kjolstad, Priyanka Raina. Designing Programmable Accelerators for Sparse Tensor Algebra
    66 -- 75Christopher J. Berry, Michael J. Becht, Tim E. Bubb, Howard Haynie, Robert J. Sonnelitter, Katie Seggerman, Jonathan Hsieh, Edward Malley, Mike Cadigan, Susan M. Eickhoff, Matthias Klein, Craig R. Walters, Christian G. Zoellin, Cédric Lichtenau. The IBM Telum II Processor
    76 -- 85Younggeun Choi, Junyoung Park, Sang Min Lee 0014, Jeseung Yeon, Minho Kim, Changjae Park, Byeongwook Bae, Hyunmin Jeong, Hanjoon Kim, June Paik, Nuno P. Lopes, Sungjoo Yoo. FuriosaAI RNGD: A Tensor Contraction Processor for Sustainable AI Computing
    86 -- 94Antti Rautakoura, Timo Hämäläinen 0001, Ari Kulmala. Three SoCs in Three Years: How to Get Agile
    97 -- 102Joshua J. Yi. A Review of Wisconsin Alumni Research Foundation v. Apple - Part IV
    103 -- 107Jianming Tong, Zishen Wan. Sipping Matcha of Security: A Fireside Chat With Mengjia Yan
    108 -- 110Shane Greenstein. The Scramble After Breakthrough
    112 -- 0Gary S. Tyson. Sally A. McKee

    Volume 45, Issue 2

    4 -- 5Hsien-Hsin S. Lee. Taiwan Semiconductor Manufacturing Company's $165 Billion Bet
    6 -- 7Whit Schonbein, Joseph Schuchart. Special Issue on Hot Interconnects 31
    8 -- 17Quentin Anthony, Benjamin Michalowicz, Jacob Hatef, Lang Xu, Mustafa Abduljabbar, Aamir Shafi, Hari Subramoni, Dhabaleswar K. Panda 0001. Understanding and Characterizing Communication Characteristics for Distributed Transformer Models
    18 -- 25Weiyang Wang, Manya Ghobadi. Spine-Free Networks for Large Language Model Training
    26 -- 35Manjunath Gorentla Venkata, Valentine Petrov, Sergey Lebedev, Devendar Bureddy, Ferrol Aderholdt, Joshua Ladd, Gil Bloch, Mike Dubman, Gilad Shainer. Unified Collective Communication: A Unified Library for CPU, GPU, and DPU Collectives
    36 -- 45Tu Tran, Goutham Kalikrishna Reddy Kuncham, Bharath Ramesh 0005, Shulei Xu, Hari Subramoni, Dhabaleswar K. Panda 0001. OHIO: Enhancing RDMA Scalability in Alltoall With Optimized Communication Overlap
    46 -- 55Jinsun Yoo, William Won, Meghan Cowan, Nan Jiang, Benjamin Klenk, Srinivas Sridharan 0002, Tushar Krishna. Toward a Standardized Representation for Deep Learning Collective Algorithms
    56 -- 64Cristina Olmedilla, Jesús Escudero-Sahuquillo, Pedro Javier García, Francisco J. Quiles 0001, Wenhao Sun, Long Yan, Yunping Lyu, José Duato. ECP: Improving the Accuracy of Congesting-Packets Identification in High-Performance Interconnection Networks
    65 -- 66Ryusuke Egawa, Yasutaka Wada. Special Issue on COOL Chips
    67 -- 77Jueun Jung, Seungbin Kim, Bokyoung Seo, Wuyoung Jang, Sangho Lee, Jeongmin Shin, Donghyeon Han, Kyuho Jason Lee. A Mobile Semantic Lidar SLAM Processor With Artificial-Intelligence-Based 3-D Perception and Spatiotemporal-Aware Computing
    78 -- 89Hoai Luan Pham, Vu Trung Duong Le, Tuan Hai Vu, Van Duy Tran, Van Tinh Nguyen, Thi Diem Tran, Yasuhiko Nakashima. MRCA 2.0: An Area-Optimized Multigrained Reconfigurable Cryptographic Accelerator for Securing Blockchain-Based Internet of Things Systems
    90 -- 100Reoma Matsuo, Yuya Degawa, Hidetsugu Irie, Shuichi Sakai, Ryota Shioya. Flexible Approximate Computing for Mitigating Branch Divergence in GPUs
    102 -- 113Kyungsoo Lee, Sohyun Kim, Joohee Lee, Donguk Moon, Rakie Kim, Honggyu Kim, Hyeongtak Ji, Yunjeong Mun, Youngpyo Joo. Improving Key-Value Cache Performance With Heterogeneous Memory Tiering: A Case Study of Compute-Express-Link-Based Memory Expansion
    114 -- 117Joshua J. Yi. A Review of Wisconsin Alumni Research Foundation v. Apple - Part III
    118 -- 120Shane Greenstein. Artificial Intelligence and the Jevons Paradox
    122 -- 124Doug Burger, Paul Chow, Joel S. Emer, Mark D. Hill, James C. Hoe, Masato Motomura. Derek Chiou

    Volume 45, Issue 1

    4 -- 5Hsien-Hsin S. Lee. Rise of the Agentic AI Workforce
    6 -- 8Debendra Das Sharma, Nam Sung Kim. Special Issue on Interconnects for Chiplet Integration Technologies
    9 -- 15Boyd Phelps, Arif Khan. Disaggregated Designs: Technology Challenges and Enablers
    16 -- 25Peter Z. Onufryk, Swadesh Choudhary. UCIe: Standard for an Open Chiplet Ecosystem
    26 -- 34Au Huynh, Kent Stahn, Manuel Mota, Christian de Verteuil, Jennifer Pyon, Reza Movahedinia. UCIe Standard: Enhancing Die-to-Die Connectivity in Modern Packaging
    35 -- 40Tony Chan Carusone, Dustin Dunwell, Sundeep Gupta, Letizia Giuliano, Adrien Auge, Michael Klempa, Sue Hung Fung. Co-Design of Interchiplet, Package, and System Interconnect Protocols
    41 -- 47Wei Tang 0010, Chester Liu, Zhengya Zhang. Energy-Efficient Parallel Interconnects for Chiplet Integration
    48 -- 56Durand Jarrett-Amor, Tony Chan Carusone. A Comparison of Single-Ended, NRZ Unidirectional Signaling and Single-Ended, NRZ Simultaneous-Bidirectional Signaling for Die-to-Die Links
    57 -- 66Alan Smith 0003, Gabriel H. Loh, Samuel Naffziger, John J. Wuu, Nathan Kalyanasundharam, Eric Chapman, Raja Swaminathan, Tyrone Huang, Wonjun Jung, Alexander Kaganov, Hugh McIntyre, Ramon Mangaser. Interconnect Design for Heterogeneous Integration of Chiplets in the AMD Instinct MI300X Accelerator
    67 -- 74Sridhar Muthrasanallur, Yervant Zorian. A Test, Debug, and Silicon Lifecycle Management Architecture for a UCIe-Based Open Chiplet Ecosystem
    76 -- 86Thommas K. S. Flores, Ivanovitch Silva, Mariana Azevedo, Thaís Medeiros, Morsinaldo Medeiros, Daniel G. Costa, Paolo Ferrari, Emiliano Sisinni. Advancing Tiny Machine Learning Operations: Robust Model Updates in the Internet of Intelligent Vehicles
    87 -- 94Tomasz Szydlo, Marcin Nagy. Management of TinyML-Enabled Internet of Things Devices
    95 -- 100Joshua J. Yi. A Review of Wisconsin Alumni Research Foundation v. Apple - Part II
    101 -- 103Shane Greenstein. Spillovers, Bottlenecks, and More Invention After Invention
    104 -- 112Mariam Elgamal, Yueying Lisa Li. Measuring What Matters: A Fireside Chat With Joel Emer
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