The following publications are possibly variants of this publication:
- ThermalScope: multi-scale thermal analysis for nanometer-scale integrated circuitsNicholas Allec, Zyad Hassan, Li Shang, Robert P. Dick, Ronggui Yang. iccad 2008: 603-610 [doi]
- Full-Spectrum Spatial-Temporal Dynamic Thermal Analysis for Nanometer-Scale Integrated CircuitsZyad Hassan, Nicholas Allec, Fan Yang, Li Shang, Robert P. Dick, Xuan Zeng. tvlsi, 19(12):2276-2289, 2011. [doi]
- Adaptive multi-domain thermal modeling and analysis for integrated circuit synthesis and designYonghong Yang, Changyun Zhu, Zhenyu (Peter) Gu, Li Shang, Robert P. Dick. iccad 2006: 575-582 [doi]