The following publications are possibly variants of this publication:
- A fast thermal-aware fixed-outline floorplanning methodology based on analytical modelsJai-Ming Lin, Tai-Ting Chen, Yen-Fu Chang, Wei-Yi Chang, Ya-Ting Shyu, Yeong-Jar Chang, Juin-Ming Lu. iccad 2018: [doi]
- Fast thermal analysis for fixed-outline 3D floorplanningQi Xu, Song Chen. integration, 59:157-167, 2017. [doi]
- Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules in a Fixed-Outline 3-D ICJai-Ming Lin, Wei-Yi Chang, Hao-Yuan Hsieh, Ya-Ting Shyu, Yeong-Jar Chang, Juin-Ming Lu. tvlsi, 29(9):1652-1664, 2021. [doi]
- Thermal-Aware Fixed-Outline 3-D IC Floorplanning: An End-to-End Learning-Based ApproachWenbo Guan, XiaoYan Tang, Hongliang Lu, YuMing Zhang, YiMen Zhang. tvlsi, 31(12):1882-1895, December 2023. [doi]
- A Novel Thermal-Aware Floorplanning and TSV Assignment With Game Theory for Fixed-Outline 3-D ICsWenbo Guan, XiaoYan Tang, Hongliang Lu, YuMing Zhang, YiMen Zhang. tvlsi, 31(11):1639-1652, November 2023. [doi]