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Kele Shen, Dong Xiang, Zhou Jiang. Dual-Speed TAM Optimization of 3D SoCs for Mid-bond and Post-bond Testing. In 23rd IEEE Asian Test Symposium, ATS 2014, Hangzhou, China, November 16-19, 2014. pages 7-12, IEEE Computer Society, 2014. [doi]
Possibly Related PublicationsThe following publications are possibly variants of this publication: An Optimization Mechanism for Mid-Bond Testing of TSV-Based 3D SoCsKele Shen, Zhigang Yu, Zhou Jiang. ieicet, 99-C(2):308-315, 2016. [doi] Layout-driven test-architecture design and optimization for 3D SoCs under pre-bond test-pin-count constraintLi Jiang, Qiang Xu, Krishnendu Chakrabarty, T. M. Mak. iccad 2009: 191-196 [doi]
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