John U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, John M. Cotte. 3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias. J. Solid-State Circuits, 41(8):1718-1725, 2006. [doi]
@article{KnickerbockerPA06,
title = {3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias},
author = {John U. Knickerbocker and Chirag S. Patel and Paul S. Andry and Cornelia K. Tsang and L. Paivikki Buchwalter and Edmund J. Sprogis and Hua Gan and Raymond R. Horton and Robert J. Polastre and Steven L. Wright and John M. Cotte},
year = {2006},
doi = {10.1109/JSSC.2006.877252},
url = {https://doi.org/10.1109/JSSC.2006.877252},
researchr = {https://researchr.org/publication/KnickerbockerPA06},
cites = {0},
citedby = {0},
journal = {J. Solid-State Circuits},
volume = {41},
number = {8},
pages = {1718-1725},
}