3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias - researchr publication related

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John U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, John M. Cotte. 3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias. J. Solid-State Circuits, 41(8):1718-1725, 2006. [doi]

The following publications are possibly variants of this publication:

Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technologyJohn U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, Christian D. Schuster, Christian W. Baks, Fuad E. Doany, Joanna Rosner, Steven Cordes. cicc 2005: 659-662 [doi]

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