The following publications are possibly variants of this publication:
- 3D stacking using Cu-Cu direct bondingY. H. Hu, C. S. Liu, M. J. Lii, K. J. Rebibis, Anne Jourdain, Antonio La Manna, Gerald Beyer, Eric Beyne, C. H. Yu. 3dic 2012: 1-4 [doi]
- Room Temperature Cu-Cu Direct Bonding Using Wetting/Passivation Scheme for 3D Integration and PackagingZhong-Jie Hong, Demin Liu, Shu-Ting Hsieh, Han-Wen Hu, Ming-Wei Weng, Chih-I Cho, Jui-Han Liu, Kuan-Neng Chen. vlsit 2022: 387-388 [doi]
- Fabrication of vertical thin-GaN light-emitting diode by low-temperature Cu/Sn/Ag wafer bondingY. J. Chen, C. C. Chang, H. Y. Lin, S. C. Hsu, C. Y. Liu. mr, 52(2):381-384, 2012. [doi]
- Investigation of growth behavior of Al-Cu intermetallic compounds in Cu wire bondingJiunn Chen, Yi-Shao Lai, Yi-Wun Wang, C. R. Kao. mr, 51(1):125-129, 2011. [doi]