P. M. Souare, François de Crecy, Vincent Fiori, H. Ben Jamaa, Alexis Farcy, Sébastien Gallois-Garreignot, A. Borbely, J.-P. Colonna, P. Coudrain, B. Giraud, C. Laviron, Séverine Cheramy, Clément Tavernier, J. Michailos. Thermal correlation between measurements and FEM simulations in 3D ICs. In 2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013. pages 1-6, IEEE, 2013. [doi]
@inproceedings{SouareCFJFGBCCGLCTM13,
title = {Thermal correlation between measurements and FEM simulations in 3D ICs},
author = {P. M. Souare and François de Crecy and Vincent Fiori and H. Ben Jamaa and Alexis Farcy and Sébastien Gallois-Garreignot and A. Borbely and J.-P. Colonna and P. Coudrain and B. Giraud and C. Laviron and Séverine Cheramy and Clément Tavernier and J. Michailos},
year = {2013},
doi = {10.1109/3DIC.2013.6702362},
url = {http://dx.doi.org/10.1109/3DIC.2013.6702362},
researchr = {https://researchr.org/publication/SouareCFJFGBCCGLCTM13},
cites = {0},
citedby = {0},
pages = {1-6},
booktitle = {2013 IEEE International 3D Systems Integration Conference (3DIC), San Francisco, CA, USA, October 2-4, 2013},
publisher = {IEEE},
}