The following publications are possibly variants of this publication:
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- Intra-channel Reconfigurable Interface for TSV and Micro Bump Fault Tolerance in 3-D RAMsKuan-Te Wu, Jin-Fu Li, Yun-Chao Yu, Chih-Sheng Hou, Chi-Chun Yang, Ding-Ming Kwai, Yung-Fa Chou, Chih-Yen Lo. ats 2014: 143-148 [doi]