Journal: Microelectronics Reliability

Volume 55, Issue 3-4

463 -- 469Chunlei Wu, SuYing Yao, Corinne Bergès. Leakage current study and relevant defect localization in integrated circuit failure analysis
470 -- 480A. S. N. Pereira, R. Giacomini. An accurate closed-expression model for FinFETs parasitic resistance
481 -- 485Chie-In Lee, Wei-Cheng Lin. MOSFET channel resistance characterization from the triode region to impact ionization region with the inductive breakdown network
486 -- 491Xiangming Xu, Jingfeng Huang, Han Yu, Biao Ma, Peng-fei Wang, David Wei Zhang. Elimination of stress induced dislocation in deep Poly Sinker LDMOS technology
492 -- 497Hatice Gül Sezgin, Yasin Özçelep. Characterization and modeling of power MOSFET switching times variations under constant electrical stress
498 -- 507G. G. Fischer, G. Sasso. Ageing and thermal recovery of advanced SiGe heterojunction bipolar transistors under long-term mixed-mode and reverse stress conditions
508 -- 513Cunbo Zhang, Jian-de Zhang, Honggang Wang, Guangxing Du. Burnout properties of microwave pulse injected on GaAs PHEMT
514 -- 519Cen Xiong, Shuhuan Liu, Yonghong Li, Du Tang, Jinxin Zhang, Xuecheng Du, Chaohui He. Hot carrier effect on the bipolar transistors' response to electromagnetic interference
520 -- 526Yang Wang, Xiangliang Jin, Liu Yang, Qi Jiang, Huihui Yuan. Robust dual-direction SCR with low trigger voltage, tunable holding voltage for high-voltage ESD protection
527 -- 537Moon-Hwan Chang, Peter Sandborn, Michael G. Pecht, Winco K. C. Yung, Wenbin Wang. A return on investment analysis of applying health monitoring to LED lighting systems
538 -- 546Atif Alkhazaili, Mohammad M. Hamasha, Gihoon Choi, Susan Lu, Charles R. Westgate. Reliability of thin films: Experimental study on mechanical and thermal behavior of indium tin oxide and poly(3, 4-ethylenedioxythiophene)
547 -- 551Thierry Kociniewski, Jeff Moussodji, Zoubir Khatir. Temperature mapping by μ-Raman spectroscopy over cross-section area of power diode in forward biased conditions
552 -- 557Emre Özkol, Franziska Brem, Chunlei Liu. Improving the power cycling performance of IGBT modules by plating the emitter contact
558 -- 564K. Dutta, B. Bhowmik, A. Hazra, P. P. Chattopadhyay, P. Bhattacharyya. An efficient BTX sensor based on p-type nanoporous titania thin films
565 -- 571Choon-W. Nahm. 1.83-based varistors
572 -- 581Seongjun Lee, Jonghoon Kim, Bo-Hyung Cho. Maximum pulse current estimation for high accuracy power capability prediction of a Li-Ion battery
582 -- 587Elviz George, Michael D. Osterman, Michael G. Pecht. An evaluation of dwell time and mean cyclic temperature parameters in the Engelmaier model
588 -- 595Ee-Hua Wong. The fundamentals of thermal-mass diffusion analogy
596 -- 601Li Yang, Yaocheng Zhang, Chengchao Du, Jun Dai, Ning Zhang. Effect of aluminum concentration on the microstructure and mechanical properties of Sn-Cu-Al solder alloy
602 -- 607J. Gomes, M. Mayer, B. Lin. Development of a fast method for optimization of Au ball bond process
608 -- 612Yi-Wei Tseng, Fei-Yi Hung, Truan-Sheng Lui. Microstructure, tensile and electrical properties of gold-coated silver bonding wire
613 -- 622Xue-Ru Guo, Wen-Bin Young. Vacuum effect on the void formation of the molded underfill process in flip chip packaging
623 -- 629Wenguo Zhang, Jian-Hua Ma, Li-Lan Gao, Zhe Zhang, Hong Gao. Fatigue life and resistance analysis of COG assemblies under hygrothermal aging
630 -- 636Cheng-Han Wu, Weng-Sing Hwang. The effect of the echo-time of a bipolar pulse waveform on molten metallic droplet formation by squeeze mode piezoelectric inkjet printing
637 -- 644Qi Jiang, Huihui Yuan, Yang Wang, Xiangliang Jin. Design and analyze of transient-induced latch-up in RS485 transceiver with on-chip TVS
645 -- 653Hao Cai, You Wang, Kaikai Liu, Lirida Alves de Barros Naviner, Hervé Petit, Jean-François Naviner. Cross-layer investigation of continuous-time sigma-delta modulator under aging effects
654 -- 661Anna Richelli, Gilbert Matig-a, Jean-Michel Redoute. Design of a folded cascode opamp with increased immunity to conducted electromagnetic interference in 0.18 μm CMOS
662 -- 670Arwa Ben Dhia, Mariem Slimani, Hao Cai, Lirida A. B. Naviner. A dual-rail compact defect-tolerant multiplexer
671 -- 678Pawel Leczycki, Artur Andrzejczak, Piotr Pietrzak, Bartosz Pekoslawski, Andrzej Napieralski. Extended Sensor Reliability Evaluation Method in multi-sensor control systems
679 -- 695Mohsen Jahanshahi, Fathollah Bistouni. Improving the reliability of the Benes network for use in large-scale systems
696 -- 703Ting An, Kaikai Liu, Hao Cai, Lirida A. B. Naviner. Accurate reliability analysis of concurrent checking circuits employing an efficient analytical method
704 -- 712Atin Mukherjee, Anindya Sundar Dhar. Real-time fault-tolerance with hot-standby topology for conditional sum adder