The following publications are possibly variants of this publication:
- Delay testing and characterization of post-bond interposer wires in 2.5-D ICsShi-Yu Huang, Li-Ren Huang, Kun-Han Tsai, Wu-Tung Cheng. itc 2013: 1-8 [doi]
- Parametric Fault Testing and Performance Characterization of Post-Bond Interposer Wires in 2.5-D ICsLi-Ren Huang, Shi-Yu Huang, Kun-Han Tsai, Wu-Tung Cheng. tcad, 33(3):476-488, 2014. [doi]
- Mid-bond Interposer Wire TestLi-Ren Huang, Shi-Yu Huang, Kun-Han Tsai, Wu-Tung Cheng, Stephen K. Sunter. ats 2013: 153-158 [doi]
- On-the-fly timing-aware built-in self-repair for high-speed interposer wires in 2.5-D ICsShi-Yu Huang, Zeng-Fu Zeng, Kun-Han Tsai, Wu-Tung Cheng. ets 2014: 1-2 [doi]