| 6 | -- | 9 | Partha Pratim Pande, Sriram R. Vangal. Guest Editors Introduction: Promises and Challenges of Novel Interconnect Technologies |
| 10 | -- | 19 | Ron Ho, Frankie Liu, Dinesh Patil, Xuezhe Zheng, Guoliang Li, I. Shubin, E. Alon, Jon Lexau, Herb Schwetman, John E. Cunningham, Ashok V. Krishnamoorthy. Optical Interconnect for High-End Computer Systems |
| 20 | -- | 31 | Hong Li, Chuan Xu, Kaustav Banerjee. Carbon Nanomaterials: The Ideal Interconnect Technology for Next-Generation ICs |
| 32 | -- | 43 | Patrick Yin Chiang, Sirikarn Woracheewan, Changhui Hu, Lei Guo, Rahul Khanna, Jay J. Nejedlo, Huaping Liu. Short-Range, Wireless Interconnect within a Computing Chassis: Design Challenges |
| 44 | -- | 53 | A. Nojeh, A. Ivanov. Wireless Interconnect and the Potential for Carbon Nanotubes |
| 54 | -- | 67 | Zheng Li, Moustafa Mohamed, Hongyu Zhou, Li Shang, Alan Rolf Mickelson, Dejan Filipovic, Manish Vachharajani, Wounjhang Park, Yihe Sun. Global On-Chip Coordination at Light Speed |
| 68 | -- | 69 | Igor L. Markov. Chips in 3D |
| 70 | -- | 71 | Andrew B. Kahng. When is 3D 2B? |
| 77 | -- | 0 | Rohit Kapur. Conference Reports |
| 80 | -- | 0 | Radu Marculescu. On-chip networks: Two sides of the same coin |