| 891 | -- | 892 | Artur Wymyslowski. Guest Editorial: 2009 EuroSimE international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems |
| 893 | -- | 899 | Hai Bo Fan, Matthew M. F. Yuen. A multi-scale approach for investigation of interfacial delamination in electronic packages |
| 900 | -- | 909 | Bernhard Wunderle, E. Dermitzaki, O. Hölck, Jörg Bauer, H. Walter, Q. Shaik, K. Rätzke, F. Faupel, Bernd Michel, Herbert Reichl. Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling |
| 910 | -- | 916 | J. de Vreugd, Kaspar M. B. Jansen, Leo J. Ernst, C. Bohm. Prediction of cure induced warpage of micro-electronic products |
| 917 | -- | 922 | Sander Noijen, Roy Engelen, Joerg Martens, Alexandru Opran, Olaf van der Sluis, Richard B. R. van Silfhout. Prediction of the epoxy moulding compound aging effect on package reliability |
| 923 | -- | 927 | Daoguo Yang, Martien Kengen, W. G. M. Peels, David Heyes, W. D. van Driel. Reliability modeling on a MOSFET power package based on embedded die technology |
| 928 | -- | 936 | Ahmer Syed, Tong Yan Tee, Hun Shen Ng, Rex Anderson, Choong Peng Khoo, Boyd Rogers. Advanced analysis on board trace reliability of WLCSP under drop impact |
| 937 | -- | 947 | D. Farley, Y. Zhou, F. Askari, M. Al-Bassyiouni, A. Dasgupta, J. F. J. Caers, J. W. C. DeVries. Copper trace fatigue models for mechanical cycling, vibration and shock/drop of high-density PWAs |
| 949 | -- | 953 | Yang-Hua Chang, Shih-Wei Lin, Chia-Hao Chang. Optimization of high voltage LDMOSFETs with complex multiple-resistivity drift region and field plate |
| 954 | -- | 958 | Xiao Zou, Guojia Fang, Longyan Yuan, Xingsheng Tong, Xingzhong Zhao. Improved electrical characteristics and reliability of amorphous InGaZnO metal-insulator-semiconductor capacitor with high kappa HfO::x::N::y:: gate dielectric |
| 959 | -- | 964 | Shih-Chun Yang, Pang Lin, Chien-Ping Wang, Sheng Bang Huang, Chiu-Ling Chen, Pei-Fang Chiang, An-Tse Lee, Mu-Tao Chu. Failure and degradation mechanisms of high-power white light emitting diodes |
| 965 | -- | 970 | A. Chakraborty, C. K. Sarkar. Electron transport in two dimensional electron gas formed at the heterojunction of Al::x::Ga::(1-::::x::::)::N/GaN at microwave frequencies |
| 971 | -- | 977 | M. Reza Javaheri, Reza Sedaghat. Strength violation effect on soft-error detection in sub-micron technology |
| 978 | -- | 985 | Satyanarayan Iyer, Krishnaswami Srihari. Assembly reliability assessment and life estimation for a stacked area array device |
| 986 | -- | 994 | Yue Ying Ong, Soon Wee Ho, Kripesh Vaidyanathan, Vasarla Nagendra Sekhar, Ming Chinq Jong, Samuel Lim Yak Long, Vincent Lee Wen Sheng, Leong Ching Wai, Vempati Srinivasa Rao, Jimmy Ong, Xuefen Ong, Xiaowu Zhang, Yoon Uk Seung, John H. Lau, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Zhang Yanfeng, Juan Boon Tan, Dong Kyun Sohn. Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package |
| 995 | -- | 999 | Wen-Bin Young. Modeling of a non-Newtonian flow between parallel plates in a flip chip encapsulation |
| 1000 | -- | 1006 | Tung T. Nguyen, Donggun Lee, Jae B. Kwak, SeungBae Park. Effect of glue on reliability of flip chip BGA packages under thermal cycling |
| 1014 | -- | 1020 | Hu Guojun, Roberto Rossi, Jing-en Luan, Xavier Baraton. Interface delamination analysis of TQFP package during solder reflow |
| 1021 | -- | 1027 | Bo Zhang, Pinkuan Liu, Han Ding, Wenwu Cao. Modeling of board-level package by Finite Element Analysis and laser interferometer measurements |
| 1028 | -- | 1038 | Da Yu, Jae B. Kwak, SeungBae Park, John Lee. Dynamic responses of PCB under product-level free drop impact |