The following publications are possibly variants of this publication:
- Full-chip Inter-die Parasitic Extraction in Face-to-Face-Bonded 3D ICsYarui Peng, Taigon Song, Dusan Petranovic, Sung Kyu Lim. iccad 2015: 649-655 [doi]
- Full-Chip Electro-Thermal Coupling Extraction and Analysis for Face-to-Face Bonded 3D ICsLingjun Zhu, Kyungwook Chang, Dusan Petranovic, Saurabh Sinha, Yun Seop Yu, Sung Kyu Lim. ispd 2020: 39-46 [doi]
- Hier-3D: A Hierarchical Physical Design Methodology for Face-to-Face-Bonded 3D ICsAnthony Agnesina, Moritz Brunion, Alberto GarcĂa Ortiz, Francky Catthoor, Dragomir Milojevic, Manu Komalan, Matheus A. Cavalcante, Samuel Riedel, Luca Benini, Sung Kyu Lim. islped 2022: [doi]
- Snap-3D: A Constrained Placement-Driven Physical Design Methodology for Face-to-Face-Bonded 3D ICsPruek Vanna-Iampikul, Chengjia Shao, Yi-Chen Lu, Sai Pentapati, Sung Kyu Lim. ispd 2021: 39-46 [doi]
- Compact-2D: A Physical Design Methodology to Build Commercial-Quality Face-to-Face-Bonded 3D ICsBon Woong Ku, Kyungwook Chang, Sung Kyu Lim. ispd 2018: 90-97 [doi]
- Block-level designs of die-to-wafer bonded 3D ICs and their design quality tradeoffsKrit Athikulwongse, Dae-Hyun Kim, Moongon Jung, Sung Kyu Lim. aspdac 2013: 687-692 [doi]