Possibly Related Publications

The following publications are possibly variants of this publication:

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• Reuse-Based Optimization for Prebond and Post-Bond Testing of 3-D-Stacked ICsMukesh Agrawal, Krishnendu Chakrabarty, Randy Widialaksono. tcad, 34(1):122-135, 2015. [doi]
• Impact of mid-bond testing in 3D stacked ICsMottaqiallah Taouil, Said Hamdioui, Erik Jan Marinissen, Sudipta Bhawmik. dft 2013: 178-183 [doi]
• Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICsBrandon Noia. PhD thesis, Duke University, Durham, NC, USA, 2014. [doi]
• Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICsBrandon Noia, Krishnendu Chakrabarty. Springer, 2014. [doi]