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2015

10th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2015, Edinburgh, UK, November 10-13, 2015IEEE, 2015. [doi]

Welcome to EMC Compo 2015emccompo 2015: [doi]

Analytical approach to study Electromagnetic emission EME contributors on DC/DC applicationsKamel Abouda, Guillaume Aulagnier, Eric Rolland, Marc Cousineau. emccompo 2015: 77-82 [doi]

Ageing effects on power RF LDMOS reliability using the Transmission Line Matrix methodAhmed Aldabbagh, Alistair Duffy. emccompo 2015: 157-162 [doi]

Direct power injection on functional and non-functional signals of SPI EEPROM memoriesMohammed Amellall, Sjoerd Op't Land, Richard Perdriau, Mohammed Ramdani, Ali Ahaitouf, M'hamed Drissi. emccompo 2015: 24-28 [doi]

Resonance analysis for EMC improvement in integrated circuitsYann Bacher, Nicolas Froidevaux, Philippe Dupre, Henri Braquet, Gilles Jacquemod. emccompo 2015: 56-60 [doi]

Case study on the differences between EMI resilience of analog ICs against continuous wave, modulated and transient disturbancesM. Burak Baran, Wim Dehaene, Hugo Pues, Kristof Stijnen. emccompo 2015: 207-211 [doi]

Radiation characteristics of small loop antenna above perforated finite image planeRaul Blecic, Renaud Gillon, Bart Nauwelaers, Adrijan Baric. emccompo 2015: 222-227 [doi]

Enhancement of the spatial resolution of near-field immunity mapsAlexandre Boyer, M. Cavarroc. emccompo 2015: 163-168 [doi]

Dynamic multi-parameter response model for SEED analysisMart Coenen, Ming Ye, Huichun Yu. emccompo 2015: 44-49 [doi]

On-chip Watchdog to monitor RTOS activity in MPSoC exposed to noisy environmentChristofer de Oliveira, Leticia Bolzani Poehls, Fabian Vargas. emccompo 2015: 61-66 [doi]

Improving the shielding effectiveness of a board-level shield by bonding it with the waveguide-below-cutoff principleAndy Degraeve, Davy Pissoort, Keith Armstrong. emccompo 2015: 50-55 [doi]

A highly-digitized automotive CAN transceiver in 0.14µm high-voltage SOI CMOSMatthieu Deloge, Arnoud P. van der Wel, Shishir Goyal, Gerald Kwakernaat, Adrien Schoof. emccompo 2015: 13-17 [doi]

Emission reduction in Class D audio amplifiers by optimizing spread spectrum modulationBernd Deutschmann, Gunter Winkler, Timucin Karaca. emccompo 2015: 1-6 [doi]

Thermal-electromagnetic susceptibility behaviors of PWM patterns used in control electronic circuitJean-Marc Dienot, Emmanuel Batista, Ioav Ramos. emccompo 2015: 190-195 [doi]

Preliminary study of Automatic Control Gain loop subjected to pulse-modulated radiofrequency interferenceA. Doridant, Jeremy Raoult, Sylvie Jarrix, J.-J. Laurin, P. Hoffmann. emccompo 2015: 109-114 [doi]

DPI set-up for ICs with differential inputsPriscila Fernandez-Lopez, M. Amara, T. Q. V. Hoang, Frédéric Lafon. emccompo 2015: 184-189 [doi]

ESD test at component levelLars Glaesser, Sven Koenig. emccompo 2015: 152-156 [doi]

Simulation of radiated emission during the design phase based on scattering parameter measurementHerbert Hackl, Gunter Winkler, Bernd Deutschmann. emccompo 2015: 228-231 [doi]

Smart power IC macromodeling for DPI analysisH. Herrmann, W. Horchler, S. Schwarz, Philipp Schroeter, Frank Klotz, M. Brignone, F. Fiori. emccompo 2015: 244-247 [doi]

Radiated electromagnetic immunity analysis of VCO using IC stripline methodJongtae Hwang, Youngbong Han, Hyunho Park, Wansoo Nah, Soyoung Kim. emccompo 2015: 147-151 [doi]

An EMI robust LIN driver with low electromagnetic emissionJohannes Gert Janschitz. emccompo 2015: 83-86 [doi]

Methodology for interference analysis during early design stages of high-performance mixed-signal ICsSergei Kapora, Marcel Hanssen, Jan Niehof, Quino Sandifort. emccompo 2015: 67-71 [doi]

Simulation model based on JEDEC JS-001-2014 for circuit simulation of HBM ESD pulses on IC levelManuel Kaufmann, Timm Ostermann. emccompo 2015: 202-206 [doi]

TSV-based current probing structure using magnetic coupling in 2.5D and 3D ICJonghoon J. Kim, Daniel H. Jung, Heegon Kim, Sunkyu Kong, Sumin Choi, Jaemin Lim, Joungho Kim. emccompo 2015: 212-215 [doi]

Characterization of the immunity of integrated circuits (ICs) at wafer levelAndrea Lavarda, Dominik Amschl, Susanne Bauer, Bernd Deutschmann. emccompo 2015: 196-201 [doi]

EMI improved chopped operational amplifierAndrea Lavarda, Bernd Deutschmann. emccompo 2015: 72-76 [doi]

Shielding structures for through silicon via (TSV) to active circuit noise coupling in 3D ICJaemin Lim, Manho Lee, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Hyunsuk Lee, Joungho Kim. emccompo 2015: 248-251 [doi]

Building interchangeable black-box models of integrated circuits for EMC simulationsMarko Magerl, Christian Stockreiter, Oliver Eisenberger, Rainer Minixhofer, Adrijan Baric. emccompo 2015: 258-263 [doi]

DC/DC converter dead-time variation analysis and far-field radiation estimationTvrtko Mandic, Raul Blecic, Renaud Gillon, Adrijan Baric. emccompo 2015: 7-12 [doi]

Experimental validation of the generalized accurate modelling method for system-level bulk current injection setups up to 1 GHzSergey Miropolsky, Stefan Jahn, Frank Klotz, Stephan Frei. emccompo 2015: 137-142 [doi]

Relation between internal terminal voltage and immunity behavior of LDO regulator circuitsHidetoshi Miyahara, Nobuaki Ikehara, Tohlu Matsushima, Takashi Hisakado, Osami Wada. emccompo 2015: 143-146 [doi]

RF interference evaluation of flexible flat cables for high-speed data transmission in mobile devicesHyun Ho Park, Dong Gun Kam, Young-Bae Park, Jiseong Kim, Jae-Deok Lim, Hark-Byeong Park, Eakhwan Song. emccompo 2015: 169-173 [doi]

Analysis of EMI reduction methods of DC-DC buck converterSanghyeok Park, Hai Au Huynh, Soyoung Kim. emccompo 2015: 92-96 [doi]

Large domain validity of MOSFET microwave-rectification responseC. Pouant, J. Raoult, P. Hoffmann. emccompo 2015: 232-237 [doi]

Developing a universal exchange format for Integrated Circuit Emission Model - Conducted EmissionsAbhishek Ramanujan, Etienne Sicard, Alexandre Boyer, Jean-Luc Levant, Christian Marot, Frédéric Lafon. emccompo 2015: 252-257 [doi]

Electromagnetic coupling circuit model of a magnetic near-field probe to a microstrip lineJeremy Raoult, Pierre Payet, Rachid Omarouayache, Laurent Chusseau. emccompo 2015: 29-33 [doi]

Examination of different adder structures concerning di/dt in a 180nm technologyAndreas Rauchenecker, Timm Ostermann. emccompo 2015: 103-108 [doi]

Role of IC substrate and ESD protections in noise propagation: Design and modelling of dedicated test chip in 40 nm technologyMario Rotigni, Mauro Merlo, Martina Cordoni, Paolo Colombo, Valentino Liberali. emccompo 2015: 97-102 [doi]

Fundamental study on randomized processing in cryptographic IC using variable clock against Correlation Power AnalysisMegumi Saito, Takaaki Mizuki, Hideaki Sone, Yu-ichi Hayashi. emccompo 2015: 39-43 [doi]

EMC and switching loss improvement for fast switching power stages by di/dt, dv/dt optimization with 10ns variable current source gate driverAlexis Schindler, Benno Koeppl, Bernhard Wicht. emccompo 2015: 18-23 [doi]

RF immunity investigations of linear DC current regulatorsPhilipp Schroeter, Frank Klotz, Marco Pamato. emccompo 2015: 119-124 [doi]

Susceptibility to EMI of high side current sensors based on chopper OpAmpsPhilipp Schroeter, Fabio Ballarin, Franco Fiori. emccompo 2015: 115-118 [doi]

EMC performance analysis of a processor/memory system using PCB and Package-On-PackageEtienne Sicard, Alexandre Boyer, Priscila Fernandez-Lopez, An Zhou, Nicolas Marier, Frédéric Lafon. emccompo 2015: 238-243 [doi]

Analysis of on-chip digital noise coupling path for wireless communication IC test chipSatoshi Tanaka, Peng Fan, Jingyan Ma, Hanae Aoki, Masahiro Yamaguchi, Makoto Nagata, Sho Muroga. emccompo 2015: 216-221 [doi]

Bandgap failure study due to parasitic bipolar substrate coupling in Smart Power mixed ICsV. Tomasevic, Alexandre Boyer, Sonia Ben Dhia. emccompo 2015: 34-38 [doi]

Functional analysis of an integrated communication interface during ESDThomas Ungru, Wolfgang Wilkening, Steffen Walker, Renato Negra. emccompo 2015: 125-130 [doi]

Near-field injection on a Safe System Basis Chip at silicon levelBertrand Vrignon, A. Doridant, K. Abouda, Y. Gao, D. Pagnoux, T. Marek. emccompo 2015: 131-136 [doi]

Time-domain EMI measurement methodologyShih-Yi Yuan, Ting-Wei Yeh, Yung-Chi Tang, Chiu-Kuo Chen. emccompo 2015: 174-178 [doi]

Arbitrary shape multilayer interconnects EMC modelling and optimizationBoyuan Zhu, Junwei Lu, Mingcheng Zhu, Mei Jiang. emccompo 2015: 87-91 [doi]

Computational electromagnetics in shielding analysis of system in packageBoyuan Zhu, Junwei Lu, Ling Sun, Haiyan Sun. emccompo 2015: 179-183 [doi]

2013

9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2013, Nara, Japan, December 15-18, 2013IEEE, 2013. [doi]

Magnetic field coupling on analog-to-digital converter from wireless power transfer system in automotive environmentBumhee Bae, Sunkyu Kong, Jonghoon J. Kim, Sukjin Kim, Joungho Kim. emccompo 2013: 238-242 [doi]

Characterization of conducted emission at high frequency under different temperatureN. Berbel, Raúl Fernández-García, Ignacio Gil. emccompo 2013: 147-151 [doi]

Characterization and modeling of electrical stresses on digital integrated circuits power integrity and conducted emissionAlexandre Boyer, Sonia Ben Dhia. emccompo 2013: 190-195 [doi]

Evaluating the impact of substrate noise on conducted EMI in automotive microcontrollersMarco Cazzaniga, Patrice Joubert Doriol, Aurora Sanna, Emmanuel Blanc, Valentino Liberali, Davide Pandini. emccompo 2013: 129-133 [doi]

The direct RF power injection method up to 18 GHz for investigating IC's susceptibilityYin-Cheng Chang, Shawn S. H. Hsu, Yen-Tang Chang, Chiu-Kuo Chen, Hsu-Chen Cheng, Da-Chiang Chang. emccompo 2013: 167-170 [doi]

Spread spectrum clocking for emission reduction of charge pump applicationsBernd Deutschmann. emccompo 2013: 123-128 [doi]

Electro-magnetic robustness of integrated circuits: from statement to predictionSonia Ben Dhia, Alexandre Boyer. emccompo 2013: 208-213 [doi]

Using the EM simulation tools to predict the Conducted Emissions level of a DC/DC boost converter: Introducing EBEM-CE modelAndré Durier, Christian Marot, Olivier Crépel. emccompo 2013: 152-157 [doi]

Evaluation of PDN impedance and power supply noise for different on-chip decoupling structuresHaruya Fujita, Hiroki Takatani, Yosuke Tanaka, Shohei Kawaguchi, Masaomi Sato, Toshio Sudo. emccompo 2013: 142-146 [doi]

A study on gate voltage fluctuation of MOSFET induced by switching operation of adjacent MOSFET in high voltage power conversion circuitTsuyoshi Funaki. emccompo 2013: 113-118 [doi]

Broadband detection of radiating moments using the TEM-cell and a phase-calibrated oscilloscopeRenaud Gillon, Niko Bako, Adrijan Baric. emccompo 2013: 27-32 [doi]

Study of radiated immunity of an electronic system in a reverberating chamberL. Guibert, P. Millot, Xavier Ferrières, Etienne Sicard. emccompo 2013: 74-77 [doi]

Conducted immunity of three Op-Amps using the DPI measurement technique and VHDL-AMS modelingSiham Hairoud, Tristan Dubois, Angelique Tetelin, Geneviève Duchamp. emccompo 2013: 53-58 [doi]

Transient analysis of EM radiation associated with information leakage from cryptographic ICsYu-ichi Hayashi, Naofumi Homma, Takafumi Aoki, Yuichiro Okugawa, Yoshiharu Akiyama. emccompo 2013: 78-82 [doi]

Anti-resonance peak frequency control by variable on-die capacitanceWataru Ichimura, Sho Kiyoshige, Masahiro Terasaki, Ryota Kobayashi, Genki Kubo, Hiroki Otsuka, Toshio Sudo. emccompo 2013: 171-174 [doi]

Estimation of data-dependent power voltage variations of FPGA by equivalent circuit modeling from on-board measurementsKengo Iokibe, Yoshitaka Toyota. emccompo 2013: 175-179 [doi]

Discrete low-frequency transistors subjected to high-frequency CW and pulse-modulated sine signalsSylvie Jarrix, Jeremy Raoult, A. Doridant, C. Pouant, P. Hoffmann. emccompo 2013: 220-225 [doi]

Modeling and analysis of open defect in through silicon via (TSV) channelDaniel H. Jung, Heegon Kim, Jonghoon J. Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi. emccompo 2013: 163-166 [doi]

Noise-immune design of Schmitt trigger logic gate using DTMOS for sub-threshold circuitsKyungsoo Kim, Wansoo Nah, Soyoung Kim. emccompo 2013: 83-88 [doi]

Design of contactless wafer-level TSV connectivity testing structure using capacitive couplingJonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park. emccompo 2013: 158-162 [doi]

Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signalingHeegon Kim, Jonghyun Cho, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park. emccompo 2013: 5-9 [doi]

A technique for estimating signal waveforms at inaccessible points in high speed digital circuitsTomohiro Kinoshita, Shoichi Hara, Eiji Takahashi, Kazuhide Uriu. emccompo 2013: 1-4 [doi]

Immunity simulation method for automotive power module using electromagnetic analysisYosuke Kondo, Kei Tsunada, Norimasa Oka, Masato Izumichi. emccompo 2013: 243-248 [doi]

Kron simulation of field-to-line coupling using a meshed and a modified Taylor cellSjoerd Op't Land, Richard Perdriau, Mohammed Ramdani, Olivier Maurice, M'hamed Drissi. emccompo 2013: 15-20 [doi]

Impedance balance control for suppression of fluctuation on ground voltage in LSI packageMasaaki Maeda, Tohlu Matsushima, Osami Wada. emccompo 2013: 134-137 [doi]

IC-Stripline design optimization using response surface methodologyTvrtko Mandic, Renaud Gillon, Adrijan Baric. emccompo 2013: 69-73 [doi]

Improvement of reproducibility of DPI method to quantify RF conducted immunity of LDO regulatorTohlu Matsushima, Nobuaki Ikehara, Takashi Hisakado, Osami Wada. emccompo 2013: 59-62 [doi]

A generalized accurate modelling method for automotive bulk current injection (BCI) test setups up to 1 GHzSergey Miropolsky, Alexander Sapadinsky, Stephan Frei. emccompo 2013: 63-68 [doi]

Noise analysis using on-chip waveform monitor in bandgap voltage referencesAkitaka Murata, Shuji Agatsuma, Daisaku Ikoma, Kouji Ichikawa, Takahiro Tsuda, Makoto Nagata, Kumpei Yoshikawa, Yuuki Araga, Yuji Harada. emccompo 2013: 226-231 [doi]

In-band spurious attenuation in LTE-class RFIC chip using a soft magnetic thin filmSho Muroga, Y. Shimada, Yasushi Endo, Satoshi Tanaka, Masahiro Yamaguchi, Naoya Azuma, Makoto Nagata, Motoki Murakami, Kazuaki Hori, Satoru Takahashi. emccompo 2013: 47-52 [doi]

Measurement-based diagnosis of wireless communication performance in the presence of in-band interferers in RF ICsMakoto Nagata, Shunsuke Shimazaki, Naoya Azuma, Satoru Takahashi, Motoki Murakami, Kazuaki Hori, Satoshi Tanaka, Masahiro Yamaguchi. emccompo 2013: 37-41 [doi]

Substrate noise reduction based on impedance balance using tunable resistancesAtsushi Nakamura, Masaaki Maeda, Tohlu Matsushima, Osami Wada. emccompo 2013: 33-36 [doi]

EMC immunity of integrated smart power transistors in a non-50Ω environmentHermann Nzalli, Wolfgang Wilkening, Rolf H. Jansen. emccompo 2013: 214-219 [doi]

Reliability analysis of an on-chip watchdog for embedded systems exposed to radiation and EMIC. Oliveira, Juliano Benfica, Letícia Maria Bolzani Poehls, Fabian Vargas, José Lipovetzky, Ariel Lutenberg, Edmundo Gatti, Fernando Hernandez, Alexandre Boyer. emccompo 2013: 89-94 [doi]

Extraction of deterministic and random LSI noise models with the printed reverberation boardUmberto Paoletti, Takashi Suga. emccompo 2013: 21-26 [doi]

Translation of automotive module RF immunity test limits into equivalent IC test limits using S-parameter IC modelsHugo Pues, Ben Brike, Celina Gazda, Peter Teichmann, Kristof Stijnen, Christian Peeters, André Durier, Dries Vande Ginste. emccompo 2013: 249-253 [doi]

An optimizing technique to lower both phase noise and susceptibility of a voltage controlled oscillatorJeremy Raoult, A. Blain, Sylvie Jarrix. emccompo 2013: 95-100 [doi]

EMC analysis of current source gate driversAlexis Schindler, Benno Koeppl, Bernhard Wicht. emccompo 2013: 101-106 [doi]

EMI resisting LDO voltage regulator with integrated current monitorPhilipp Schroeter, Stefan Jahn, Frank Klotz, Fabio Ballarin, Fabio Gini, Marco Piselli. emccompo 2013: 107-112 [doi]

Signal integrity and EMC performance enhancement using 3D integrated circuits - A case studyEtienne Sicard, Jianfei Wu, Jiancheng Li. emccompo 2013: 10-14 [doi]

Microcontroller emission simulation based on power consumption and clock systemThomas Steinecke. emccompo 2013: 180-185 [doi]

System-ESD validation of a microcontroller with external RC-filterThomas Steinecke, Markus Unger, Stanislav Scheier, Stephan Frei, Josip Bacmaga, Adrijan Baric. emccompo 2013: 196-201 [doi]

Active magnetic field canceling systemWei-Li Sun, Feng-Chang Chuang, Yu-Lin Song, Chwen Yu, Tzyh-Ghuang Ma, Tzong-Lin Wu, Luh-Maan Chang. emccompo 2013: 119-122 [doi]

Automatic verification of EMC immunity by simulationBertrand Vrignon, P. Caunegre, John Shepherd, Jianfei Wu. emccompo 2013: 202-207 [doi]

Chair's welcomeOsami Wada. emccompo 2013: 1 [doi]

Immunity evaluation of inverter chains against RF power on power delivery networkKumpei Yoshikawa, Yuji Harada, Noriyuki Miura, Noriaki Takeda, Yoshiyuki Saito, Makoto Nagata. emccompo 2013: 232-237 [doi]

A microcontrller conducted EMI model building for software-level effectShih-Yi Yuan. emccompo 2013: 186-189 [doi]

Automatic conducted-EMI microcontroller model buildingShih-Yi Yuan, Shry-Sann Liao. emccompo 2013: 138-141 [doi]

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