Journal: Microelectronics Reliability

Volume 47, Issue 6

839 -- 840Tibor Grasser, Siegfried Selberherr. Editorial
841 -- 852Dieter K. Schroder. Negative bias temperature instability: What do we understand?
853 -- 862Muhammad Ashraful Alam, Haldun Kufluoglu, D. Varghese, S. Mahapatra. A comprehensive model for PMOS NBTI degradation: Recent progress
863 -- 872S. Chakravarthi, A. T. Krishnan, V. Reddy, S. Krishnan. Probing negative bias temperature instability using a continuum numerical framework: Physics to real world operation
873 -- 879Helmut Puchner. NBTI product level reliability for a low-power SRAM technology
880 -- 889M. Houssa, M. Aoulaiche, Stefan De Gendt, Guido Groeseneken, Marc M. Heyns. Negative bias temperature instabilities in HfSiO(N)-based MOSFETs: Electrical characterization and modeling
890 -- 898P. M. Lenahan. Deep level defects involved in MOS device instabilities
903 -- 911Sokrates T. Pantelides, L. Tsetseris, S. N. Rashkeev, X. J. Zhou, Daniel M. Fleetwood, Ronald D. Schrimpf. Hydrogen in MOSFETs - A primary agent of reliability issues
913 -- 923E. Atanassova, Albena Paskaleva. Challenges of Ta::2::O::5:: as high-k dielectric for nanoscale DRAMs
924 -- 929C. Y. Lu, H. C. Lin, Y.-J. Lee. Dynamic NBTI characteristics of PMOSFETs with PE-SiN capping
930 -- 936Rihito Kuroda, Akinobu Teramoto, Kazufumi Watanabe, Michihiko Mifuji, Takahisa Yamaha, Shigetoshi Sugawa, Tadahiro Ohmi. Circuit level prediction of device performance degradation due to negative bias temperature stress
937 -- 943W. B. Chen, J. P. Xu, P. T. Lai, Y. P. Li, S. G. Xu. Gate leakage properties of MOS devices with tri-layer high-k gate dielectric
944 -- 952Chieh-Ming Lai, Yean-Kuen Fang, Chien Ting Lin, Chia-Wei Hsu, Wen-Kuan Yeh. The impacts of high tensile stress CESL and geometry design on device performance and reliability for 90 nm SOI nMOSFETs
953 -- 958Partha Sarkar, Abhijit Mallik, Chandan Kumar Sarkar. Performance comparison of channel engineered deep sub-micrometer pseudo SOI n-MOSFETs
959 -- 966Han-Chang Tsai. An investigation on the influence of electromagnetic interference induced in conducting wire of universal LEDs
967 -- 971Chia-Huai Ho, Kuei-Shu Chang-Liao, Ya-Nan Huang, Tien-Ko Wang, T. C. Lu. Performance and reliability improvement of flash device by a novel programming method
972 -- 985Hyong Tae Kim, Hae Jeong Yang, Seung Yub Baek. Iterative algorithm for automatic alignment by object transformation
986 -- 995Dubravka Rocak, S. Macek, J. Sitek, Marko Hrovat, K. Bukat, Z. Drozd. A reliability study of the lead-free solder connections of miniature chip components on hybrid circuits
996 -- 997Mile K. Stojcev. Mohamed Ilyas, Imad Mahgoud, Handbook of Sensor Networks: Compact Wireless and Wired Sensing Systems, Hardcover, pp 864, CRC Press, 2005, ISBN 0-8493-1968-4