Journal: IBM Journal of Research and Development

Volume 39, Issue 6

602 -- 602H. Kumar Wickramasinghe, Daniel Rugar. Preface
603 -- 616Phaedon Avouris, In-Whan Lyo, Yukio Hasegawa. Probing electrical transport, electron interference, and quantum size effects at surfaces with STM/STS
617 -- 628C. Mathew Mate. Force microscopy studies of the molecular origins of friction and lubrication
629 -- 638Martin A. Lutz, Randall M. Feenstra, Jack O. Chu. Atomic force microscopy studies of SiGe films and Si/SiGe heterostructures
639 -- 654David D. Chambliss, Robert J. Wilson, Shirley Chiang. The use of STM to study metal film epitaxy
655 -- 668John R. Kirtley, Mark B. Ketchen, Chang C. Tsuei, Jonathan Z. Sun, William J. Gallagher, Lock See Yu-Jahnes, Arunava Gupta, Kevin G. Stawiasz, Shalom J. Wind. Design and applications of a scanning SQUID microscope
669 -- 680Gary M. McClelland, Harry Heinzelmann, Fumiya Watanabe. The femtosecond field-emission camera, a device for continuous observation of the motion of individual adsorbed atoms and molecules
681 -- 700H. Jonathon Mamin, Bruce D. Terris, Long-Sheng Fan, Storrs Hoen, Robert C. Barrett, Daniel Rugar. High-density data storage using proximal probe techniques
701 -- 712Dieter W. Pohl. Some thoughts about scanning probe microscopy, micromechanics, and storage

Volume 39, Issue 5

523 -- 530Takashi Ohta. Use of multiple representations for simulating cloth shapes and motions: An overview
531 -- 546Hideto Niijima. Design of a solid-state file using flash EEPROM
547 -- 568Alina Deutsch, Gerard V. Kopcsay, Christopher W. Surovic, Barry J. Rubin, Lewis M. Terman, Richard P. Dunne Jr., Thomas A. Gallo, Robert H. Dennard. Modeling and characterization of long on-chip interconnections for high-performance microprocessors
569 -- 574Ramin A. Nobakht. An algorithm for adaptive cancellation of phase jitter
575 -- 582Ramesh C. Agarwal, Susanne M. Balle, Fred G. Gustavson, Mahesh V. Joshi, Prasad V. Palkar. A three-dimensional approach to parallel matrix multiplication

Volume 39, Issue 4

370 -- 370T. S. Kuan. Preface
371 -- 382James G. Ryan, Robert M. Geffken, Neil R. Poulin, Jurij R. Paraszczak. The evolution of interconnection technology at IBM
383 -- 402Daniel C. Edelstein, George A. Sai-Halasz, Yuh-Jier Mii. VLSI on-chip interconnection performance simulations and measurements
403 -- 418Randy W. Mann, Larry A. Clevenger, Paul D. Agnello, Francis R. White. Silicides and local interconnections for high-performance VLSI applications
419 -- 436Thomas J. Licata, Evan G. Colgan, James M. E. Harper, Stephen E. Luce. Interconnect fabrication processes and the development of low-cost wiring for CMOS products
437 -- 464Donna R. Cote, Son Van Nguyen, William J. Cote, Scott L. Pennington, Anthony K. Stamper, Dragan V. Podlesnik. Low-temperature chemical vapor deposition processes and dielectrics for microelectronic circuit manufacturing at IBM
465 -- 498Chao-Kun Hu, Kenneth P. Rodbell, Timothy D. Sullivan, Kim Y. Lee, Dennis P. Bouldin. Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines

Volume 39, Issue 3

283 -- 294Jeffrey C. Lagarias, Charles Philippe Tresser. A walk along the branches of the extended Farey Tree
295 -- 314Peter A. Franaszek, Randolph D. Nelson. Properties of delay-cost scheduling in time-sharing systems
315 -- 330Joonho Park, Stamatis Vassiliadis, José G. Delgado-Frias. Flexible oblivious router architecture
331 -- 334Ramin A. Nobakht. A unified table-based Viterbi subset decoder for high-speed voice-band modems

Volume 39, Issue 1-2

3 -- 4Daniel J. Fleming. Preface
5 -- 22Robert F. Sechler, Gregory F. Grohoski. Design at the system level with VLSI CMOS
23 -- 32Robert F. Sechler. Interconnect design with VLSI CMOS
33 -- 42Kerry Bernstein, John E. Bertsch, Lawrence G. Heller, Edward J. Nowak, Francis R. White. Reduced-voltage power/performance optimization of the 3.6-volt PowerPC 601 Microprocessor
43 -- 50Toshio Sunaga, Koji Hosokawa, Sang H. Dhong, Koji Kitamura. A 64Kb - 32 DRAM for graphics applications
51 -- 62Wayne F. Ellis, John E. Barth Jr., Sri Divakaruni, Jeffrey Dreibelbis, Anatol Furman, Erik L. Hedberg, Hsing-San Lee, Thomas M. Maffitt, Christopher P. Miller, Charles H. Stapper, Howard L. Kalter. Multipurpose DRAM architecture for optimal power, performance, and product flexibility
63 -- 72Daniel M. Kuchta, Herschel A. Ainspan, Frank J. Canora, Richard P. Schneider Jr.. Performance of fiber-optic data links using 670-nm cw VCSELs and a monolithic Si photodetector and CMOS preamplifier
73 -- 82John F. Ewen, Mehmet Soyuer, Albert X. Widmer, Kevin R. Wrenner, Benjamin D. Parker, Herschel A. Ainspan. CMOS circuits for Gb/s serial data communication
83 -- 92Hyun J. Shin, Dale J. Pearson, Scott K. Reynolds, Andrew C. Megdanis, Sudhir M. Gowda, Kevin R. Wrenner. Custom design of CMOS low-power high-performance digital signal-processing macro for hard-disk-drive applications
93 -- 104Roland A. Bechade, Robert M. Houle. Digital delay line clock shapers and multipliers
105 -- 112Sang H. Dhong, Masahiro Tanaka, Steven W. Tomashot, Toshiaki Kirihata. A low-noise TTL-compatible CMOS off-chip driver circuit
113 -- 130Pradip Bose, S. Surya. Architectural timing verification of CMOS RISC processors
131 -- 148Reinaldo A. Bergamaschi, Richard A. O Connor, Leon Stok, Michael Z. Moricz, Shiv Prakash, Andreas Kuehlmann, D. Sreenivasa Rao. High-level synthesis in an industrial environment
149 -- 166Andreas Kuehlmann, Arvind Srinivasan, David P. LaPotin. Verity - A formal verification program for custom CMOS circuits
167 -- 188Eric Adler, John K. DeBrosse, Stephen F. Geissler, Steven J. Holmes, Mark D. Jaffe, Jeffrey B. Johnson, Charles W. Koburger III, Jerome B. Lasky, Brian Lloyd, Glen L. Miles, James S. Nakos, Wendell P. Noble Jr., Steven H. Voldman, Michael Armacost, Richard Ferguson. The evolution of IBM CMOS DRAM technology
189 -- 200Donald G. Chesebro, James W. Adkisson, Lyman R. Clark, Steven N. Eslinger, Margaret A. Faucher, Steven J. Holmes, Raymond P. Mallette, Edward J. Nowak, Edward W. Sengle, Steven H. Voldman, Thomas W. Weeks. Overview of gate linewidth control in the manufacture of CMOS logic chips
201 -- 214George A. Leonovich, Anthony P. Franchino, William J. Miller, Uh-Po Eric Tsou. Integrated cost and productivity learning in CMOS semiconductor manufacturing
215 -- 228Charles W. Koburger III, William F. Clark, James W. Adkisson, Eric Adler, Paul E. Bakeman, Albert S. Bergendahl, Alan B. Botula, W. Chang, Bijan Davari, John H. Givens, Howard H. Hansen, Steven J. Holmes, David V. Horak, Chung Hon Lam, Jerome B. Lasky, Stephen E. Luce, Randy W. Mann, Glen L. Miles, James S. Nakos, Edward J. Nowak, Ghavam Shahidi, Yuan Taur, Francis R. White, Matthew R. Wordeman. A half-micron CMOS logic generation
229 -- 244G. G. Shahidi, James D. Warnock, James Comfort, Stephen E. Fischer, Patricia A. McFarland, Alexandre Acovic, Terry I. Chappell, Barbara A. Chappell, Tak H. Ning, Carl J. Anderson, Robert H. Dennard, J. Y.-C. Sun, Michael R. Polcari, Bijan Davari. CMOS scaling in the 0.1-µm, 1.X-volt regime for high-performance applications
245 -- 260Yuan Taur, Yuh-Jier Mii, David J. Frank, H.-S. Philip Wong, Douglas A. Buchanan, Shalom J. Wind, Stephen A. Rishton, Watson A. Sai-Halasz, Edward J. Nowak. CMOS scaling into the 21st century: 0.1 µm and beyond