561 | -- | 572 | Foster F. Dai, Charles E. Stroud, Dayu Yang. Automatic linearity and frequency response tests with built-in pattern generator and analyzer |
573 | -- | 586 | Nitin Mohan, W. Fung, Derek Wright, Manoj Sachdev. Design techniques and test methodology for low-power TCAMs |
587 | -- | 595 | Eric MacDonald, Nur A. Touba. Delay testing of partially depleted silicon-on-insulator (PD-SOI) circuits |
596 | -- | 608 | Kanishka Lahiri, Anand Raghunathan, Ganesh Lakshminarayana. The LOTTERYBUS on-chip communication architecture |
609 | -- | 615 | Byeong Kil Lee, Lizy Kurian John, Eugene John. Architectural enhancements for network congestion control applications |
616 | -- | 624 | Tzyy-Kuen Tien, Chih-Shen Tsai, Shih-Chieh Chang, Chingwei Yeh. Power minimization for dynamic PLAs |
625 | -- | 636 | Arun Kejariwal, Sumit Gupta, Alexandru Nicolau, Nikil D. Dutt, Rajesh K. Gupta. Energy efficient watermarking on mobile devices using proxy-based partitioning |
637 | -- | 641 | Masud H. Chowdhury, Yehea I. Ismail. Realistic scalability of noise in dynamic circuits |
641 | -- | 646 | Junmou Zhang, Eby G. Friedman. Crosstalk modeling for coupled RLC interconnects with application to shield insertion |
646 | -- | 649 | Chris H. Kim, Kaushik Roy, Steven Hsu, Ram Krishnamurthy, Shekhar Borkar. A process variation compensating technique with an on-die leakage current sensor for nanometer scale dynamic circuits |
649 | -- | 654 | Sunghoon Chun, YongJoon Kim, Jung-Been Im, Sungho Kang. MICRO: a new hybrid test data compression/decompression scheme |
654 | -- | 659 | J. Balachandran, Steven Brebels, G. Carchon, M. Kuijk, Walter De Raedt, Bart Nauwelaers, Eric Beyne. Wafer-level package interconnect options |
659 | -- | 662 | Mohammed Benaissa, Wei Ming Lim. Design of flexible GF(2:::m:::) elliptic curve cryptography processors |