2010
2009
- 3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV)Jan Van Olmen, Jan Coenen, Wim Dehaene, Kristin De Meyer, Cedric Huyghebaert, Anne Jourdain, Guruprasad Katti, Abdelkarim Mercha, Micha Rakowski, Michele Stucchi, Youssef Travaly, Eric Beyne, Bart Swinnen. 3dic 2009: 1-5 [doi]
2007
2006
2005
2003
- Modified micro-macro thermo-mechanical modelling of ceramic ball grid array packagesBart Vandevelde, Dominiek Degryse, Eric Beyne, Eric Roose, Dorina Corlatan, Guido Swaelen, Geert Willems, Filip Christiaens, Alcatel Bell, Dirk Vandepitte. mr, 43(2):307-318, 2003. [doi]
1995